Soldering is a technique for joining metals using a filler metal alloy that has a melting temperature less than about 425°C (800°F). Because of this lower temperature and different alloys used as fillers, the metallurgical reaction between filler and work piece is minimal, resulting in a weaker joint. In electronics assembly, the eutectic alloy with 63% tin and 37% lead (or 60/40, which is almost identical in melting point) has been the alloy of choice. This eutectic alloy has melting point lower than those of either tin or lead.
Tin is an important constituent in solders because it wets and adheres to many common base metals at temperatures considerably below their melting points. Small amounts of various metals, notably antimony and silver, are added to tin-lead solders to increase their strength. 60-40 solder provides strong and reliable joints under a variety of environmental conditions. There are also high-tin solders, which are used for joining parts of electrical apparatuses because their electrical conductivity is higher than that of high-lead solders. These solders are also used where lead may be a hazard, for example, in contact with drinking water or food.
Thermal Properties of Soft Solder – 60-40 Solder
Thermal properties of materials refer to the response of materials to changes in their thermodynamics/thermodynamic-properties/what-is-temperature-physics/”>temperature and to the application of heat. As a solid absorbs thermodynamics/what-is-energy-physics/”>energy in the form of heat, its temperature rises and its dimensions increase. But different materials react to the application of heat differently.
Heat capacity, thermal expansion, and thermal conductivity are properties that are often critical in the practical use of solids.
Melting Point of Soft Solder – 60-40 Solder
Melting point of soft solder – 60-40 solder is around 183°C.
In general, melting is a phase change of a substance from the solid to the liquid phase. The melting point of a substance is the temperature at which this phase change occurs. The melting point also defines a condition in which the solid and liquid can exist in equilibrium.
Thermal Conductivity of Soft Solder – 60-40 Solder
The thermal conductivity of soft solder – 60-40 solder is 50 W/(m.K).
The heat transfer characteristics of a solid material are measured by a property called the thermal conductivity, k (or λ), measured in W/m.K. It is a measure of a substance’s ability to transfer heat through a material by conduction. Note that Fourier’s law applies for all matter, regardless of its state (solid, liquid, or gas), therefore, it is also defined for liquids and gases.
The thermal conductivity of most liquids and solids varies with temperature. For vapors, it also depends upon pressure. In general:
Most materials are very nearly homogeneous, therefore we can usually write k = k (T). Similar definitions are associated with thermal conductivities in the y- and z-directions (ky, kz), but for an isotropic material the thermal conductivity is independent of the direction of transfer, kx = ky = kz = k.
Electrical Resisitivity of Soft Solder – 60-40 Solder
Electrical resistivity of soft solder – 60-40 solder is 150 x 10−9 Ω·m.
Electrical resistivity and its converse, electrical conductivity, is a fundamental property of a material that quantifies how strongly it resists or conducts the flow of electric current. A low resistivity indicates a material that readily allows the flow of electric current. The symbol of resistivity is usually the Greek letter ρ (rho). The SI unit of electrical resistivity is the ohm-metre (Ω⋅m). Note that, electrical resistivity is not the same as electrical resistance. Electrical resistance is expressed in Ohms. While resistivity is a material property, resistance is the property of an object.
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