What is Composition of Soft Solder – 60-40 Solder - Definition

60-40 soft solder, that contains 60% of tin and 40% of lead provides strong and reliable joints under a variety of environmental conditions. Composition of Soft Solder – 60-40 Solder

Soldering is a technique for joining metals using a filler metal alloy that has a melting temperature less than about 425°C (800°F). Because of this lower temperature and different alloys used as fillers, the metallurgical reaction between filler and work piece is minimal, resulting in a weaker joint. In electronics assembly, the eutectic alloy with 63% tin and 37% lead (or 60/40, which is almost identical in melting point) has been the alloy of choice. This eutectic alloy has melting point lower than those of either tin or lead.

Tin is an important constituent in solders because it wets and adheres to many common base metals at temperatures considerably below their melting points. Small amounts of various metals, notably antimony and silver, are added to tin-lead solders to increase their strength. 60-40 solder provides strong and reliable joints under a variety of environmental conditions. There are also high-tin solders, which are used for joining parts of electrical apparatuses because their electrical conductivity is higher than that of high-lead solders. These solders are also used where lead may be a hazard, for example, in contact with drinking water or food.

References:

Materials Science:

U.S. Department of Energy, Material Science. DOE Fundamentals Handbook, Volume 1 and 2. January 1993.
U.S. Department of Energy, Material Science. DOE Fundamentals Handbook, Volume 2 and 2. January 1993.
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Gaskell, David R. (1995). Introduction to the Thermodynamics of Materials (4th ed.). Taylor and Francis Publishing. ISBN 978-1-56032-992-3.
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J. R. Lamarsh, A. J. Baratta, Introduction to Nuclear Engineering, 3d ed., Prentice-Hall, 2001, ISBN: 0-201-82498-1.

See above:
Tin Alloys

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